The six stacks of semiconductors for hybrid complementary metal-oxide semiconductor (CMOS) microchips advances miniaturization and topples the previous record of two stack King Abdullah University of ...
(Left) Atomic force microscope image of diamond epilayer surface morphology. (Middle) Optical microscope image of the diamond MOSFET. (Right) Performance of the MOSFET measured at 300°C. The drain ...
Canadian digital imaging developer DALSA has launched the first in a new family of x-ray digital detector panels based on complementary metal-oxide semiconductor (CMOS) technology, the company said.
Intel's upcoming RibbonFET technology is set to debut in the company's 20A node next year, but already the chip maker is showcasing the next step: 3D stacked CMOS (complementary metal oxide ...
CMOS image sensors have become a cornerstone of modern imaging, leveraging the advantages of low power consumption, high speed, and scalability inherent in complementary metal–oxide–semiconductor ...
A new technical paper titled “Vertical-Stack Nanowire Structure of MOS Inverter and TFET Inverter in Low-temperature Application” was published by researchers at National Tsing Hua University and ...
Debuting as the market’s first 10-Gb Ethernet physical-layer large-scale integration (LAN-PHY LSI) transceiver designed using a combination of silicon-on-insulator and complementary metal-oxide ...
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