EDN

Austriamicrosystems, IBM team for CMOS HV process

MUNICH, Germany — IBM and Austriamicrosystems have agreed to share a jointly developed high voltage CMOS manufacturing process. This will enable both companies as well as their foundry customers to ...
EDN

ST offers networking variant on ISDA 32-nm bulk CMOS

LONDON — European chip company STMicroelectronics NV (Geneva, Switzerland) has announced the availability of a bulk 32-nanometer CMOS manufacturing process and “platform” for the development of ASICs ...
Electronic Design

Alliance Produces Ultra-Dense SRAM Cell In 45nm CMOS Technology

The Crolles2 Alliance has described at the VLSI Symposium in Kyoto, Japan, the creation, under production conditions, of six-transistor SRAM-bit cells with an area less than 0.25 square microns—half ...
Electronic Design

Philips Ramps 90-nm CMOS Products Into High-Volume

Philips ramped up three key 90-nm CMOS products into volume production at the Crolles2 Alliance wafer fab in Crolles, France. The products are baseband chips for highly integrated system-inapackage ...
ExtremeTech

Beyond 7nm and silicon: The first III-V CMOS wafers roll off production lines

Imec, perhaps the world's top semiconductor research center, has created the first monolithic III-V CMOS transistors on 300mm silicon wafers. With current silicon-based transistors hitting a wall at ...
Optics

Hybrid laser diode suits CMOS wafer fabrication process

A Grenoble, France-based research team at CEA Leti and chip maker STMicroelectronics say that they have demonstrated the first hybrid III-V/silicon laser to be fabricated using a wafer manufacturing ...
Optics

Micledi creates microLED arrays for AR based on 300mm CMOS platform

Micledi Microdisplays, a Leuven, Belgium-based developer of microLED displays for high-end augmented reality (AR) glasses, has demonstrated the industry's first microLED arrays-for-AR built on a 300mm ...