Chip shipments are dropping, but your next phone will be smarter and pricier as the industry doubles down on premium AI and 2nm tech.

MediaTek promises big improvements with the new Dimensity 9400 chipset built on TSMC’s 3nm process, offering more efficiency and power with an upgraded focus on generative AI. MediaTek shifted last ...

The RedMagic 11 Air is being positioned as the first “Air” model with an active cooling fan. The phone leans heavily on ...

MSI has jumped the gun on Computex by revealing some fresh details about its upcoming X570 motherboards on an MSI Insider livestream. The initial focus of the segment, towards the end of the ...

Microsoft is also inviting developers and AI startups to explore model and workload optimisation with the new Maia 200 SDK.

The OnePlus 15T is expected to launch soon, with leaks revealing details about its India pricing, camera setup, chipset, ...

At its annual Snapdragon Summit on Tuesday, Qualcomm revealed its latest mobile chipset. Perhaps the biggest change in the Snapdragon 8 Gen 3 is the introduction of on-device generative AI (akin to ...

AMD's X570 chipset was stacked with potent I/O, but presented a significant annoyance for buyers: it required active cooling. That meant a return to the days of yore when the use of faster and faster ...