Some of the world's most advanced research in micro- and nanoelectronic-packaging reliability is taking place in the Electronic Packaging Laboratory in Some of the world's most advanced research in ...

BEDFORD, Mass., July 29, 2025 /PRNewswire/ -- Diversified Technologies, Inc. (DTI) has introduced a fully integrated turnkey package housing a DC power supply and all of the electronic components and ...

A new technical paper titled “Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies” ...

The true-impedance-profile is very powerful because it opens up other interesting venues for FA on electronic packages. For example, because the true-impedance-profile represents an exact signature of ...

BUFFALO, N.Y. -- Some of the world's most advanced research in micro- and nanoelectronic-packaging reliability is taking place in the Electronic Packaging Laboratory in the University at Buffalo ...

Some of the world's most advanced research in micro- and nanoelectronic-packaging reliability is taking place in the Electronic Packaging Laboratory in the UB School of Engineering and Applied ...

A review of surface-mount power semiconductor packages intended for portable electronics. Brach Cox, Toshiba America Electronic Components Inc., Irvine, Calif. As the size of portable electronic ...

Samsung Electronics has started mass production for the industry’s thinnest 12-nanometer (nm)-class, 12-gigabyte (GB) and 16-GB LPDDR5X DRAM packages. The LPDDR package stacks four layers of ...

The first of the U.S. Navy's new YT-808 tugs being built by Dakota Creek Industries (DCI) has been outfitted with a sophisticated marine electronics package from Furuno. Mackay Marine selected and ...

A technical paper titled “Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin” was published by researchers at Delft University of Technology and NXP ...