Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

Compression molded bulk carbon/epoxy molding compound costs significantly less than hand-layed sandwich construction because much of the latter’s touch labor is eliminated. The molding process enables ...

COLUMBUS, Ohio--(BUSINESS WIRE)--FastRTM, a project of an industry consortium supported by IRT M2P, focused on enabling composite mass production, used a specialty epoxy resin system from Hexion Inc. ...

There are some realities of life that you can’t change, like taxes. Another is that an automotive supplier must have the ability to produce a composite part in a minute, or at least in minutes — not ...

Bringing mass reduction capabilities to mass production facilities, Dow Automotive can now offer 90-second cycle times for resin transfer molding (RTM) with Voraforce 5300 resin matrix, making ...