Computerworld

PCI building thinner interconnect for handheld devices

The PCI-Express standards-setting organization is creating a thin interconnect that would link mobile devices such as smartphones and tablets to external peripherals, the organization’s chief said on ...
Business Wire

ASE’s VIPack™ Enables Innovational AI Devices Through Advanced Interconnect Technology for Chiplets

SUNNYVALE, Calif.--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX) (TAIEX: 3711), today announced that it has extended its ...
Seeking Alpha

Industry First: Single-Device Interconnect Isolation Solution for Critical Power Sustainability

ASCO Power Technologies unveils a single-device solution to streamline BESS deployment for backup applications. FLORHAM PARK, N.J., Jan. 23, 2024 /PRNewswire/ -- Battery Energy Storage Systems (BESS) ...
Business Wire

Avicena Announces Scalable Sub-pJ/bit LightBundle™ Chiplet Interconnect with 10m Reach

Artificial intelligence (AI) is driving an unprecedented surge in demand for compute and memory performance, driven by applications like ChatGPT based on large language models (LLMs). This requires ...

Syenta raises $26M in funding to speed up chip interconnect production

Australian chip manufacturing startup Syenta Inc. today announced that it has raised $26 million in funding to expand its ...
EurekAlert!

Device enables direct communication among multiple quantum processors

Quantum computers have the potential to solve complex problems that would be impossible for the most powerful classical supercomputer to crack. Just like a classical computer has separate, yet ...

AMD UALink strategy: Can AMD disrupt AI data center dominance as open interconnect challenges NVIDIA NVLink ecosystem control?

AMD UALink Standard is driving a major shift in AI infrastructure right now. Advanced Micro Devices is leading this open ...
Nasdaq

Rockley Photonics Demonstrates Compact 4-Kelvin Silicon Photonics Modulator Enabling Interconnect Technologies for Ultra-sensitive Image Detection and Sensing Devices

- Groundbreaking technology supports infrared and hyperspectral image detection and sensing devices to view images more clearly, at longer distances, and in low-light situations. - In collaboration ...
MarketWatch

3D/Additive Electronics Market Report 2026-2036: 3D Surface Electronics, Molded Interconnect Devices and Surface Metallization Drive Growth Through Design Flexibility and ...

The "The Global 3D/Additive Electronics Market 2026-2036" report has been added to ResearchAndMarkets.com's offering. The Global 3D/Additive Electronics Market 2026-2036 report represents the ...
Digi Times

Foxconn Interconnect Technology to start new Middle East plant by 2025 end amid AI-driven mobility push

Foxconn Interconnect Technology (FIT), a subsidiary of Hon Hai Precision Industry Co. (Foxconn), hosted its first FIT Tech Day 2025 on September 17, spotlighting its strategic focus on AI mobility and ...