Semiconductor Engineering

Optimizing Interconnect Topologies For Automotive ADAS Applications

Designing automotive Advanced Driver Assistance Systems (ADAS) applications can be incredibly complex. State-of-the-art ADAS and autonomous driving systems use ‘sensor fusion’ to combine inputs from ...
Semiconductor Engineering

2024 Set The Stage For NoC Interconnect Innovations In SoC Design

What a year it’s been for Arteris! Reflecting on 2024, the company achieved exciting milestones and breakthroughs that pushed the boundaries of system-on-chip (SoC) design. A game-changing new ...
RF Globalnet

Molex Completes Acquisition Of Smiths Interconnect, Expanding Portfolio Of High-Reliability Connectivity Solutions

Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based Smiths Group plc, marking a major milestone in ...
Nature

Advanced Interconnect Materials and Technologies

Advanced interconnect materials and technologies represent a pivotal aspect of modern integrated circuits, addressing both the miniaturisation of device architectures and the increasing performance ...
EDN

Describing the foundations for 22-nm CMOS logic and SRAM

A collection of papers at this month's International Electron Devices Meeting (IEDM) illustrates the frantic work underlying the industry's gradual move toward a manufacturable 22-nm SOC. Work in ...
Panel Building & System Integration

Molex acquires Smiths Interconnect to expand portfolio of high-reliability connectivity solutions

Molex has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based Smiths Group plc, marking a ...
Morningstar

Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions

LISLE, Ill., April 1, 2026 /PRNewswire/ -- Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based ...