BGA soldering is very reliable if done using the correct procedure, so we introduce GA Soldering on PCB board, BGA Inspection and BGA Rework. According to different packaging materials, BGA components ...
The ball grid array (BGA) is a surface-mount chip package that is used to mount embedded devices (e.g. microprocessors) by melting balls of solder between the face of the device and the circuit board.
The 0.8 mm pitch BGA socket adapter from Ironwood Electronics provides an interposer solution for prototyping, testing and ...
Mod5 Series flip-top BGA socket requires no tooling or mounting holes, maximizing PCB real estate while reducing costs. For test, debug, and validation of 0.5-mm pitch BGA devices, the Mod5 Series ...
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