Solder joint faults can be described with a single word – pernicious. Solder joints connect the BGA package, containing an FPGA (Field Programmable Gate Array) core, to the PCB (Printed Circuit Board) ...
X-ray and advanced automated techniques combine to create a capable tool for lead-free solder inspection needs. Within two years, solder used in electronics manufactured or sold in Europe must meet ...
Cold soldering defects in a PV module. The problem has now become the most commonly found defect in pre-shipping module inspections. Image: CEA The electric grid is complex. For many generation ...
PHOENIX--(BUSINESS WIRE)--Spirit Electronics, a value-added microelectronics distributor, is rolling out additional capacity for its automated BGA reballing service. Spirit’s high-efficiency ...
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