In 1999, Stig Oresjo, then of Agilent Technologies, conducted a major study of solder-joint defects on printed-circuit boards (PCBs). The study, which at the time provided the most definitive data on ...
Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for ...
We might be amidst a chip shortage, but if you enjoy reverse-engineering, there’s never a shortage of intriguing old chips to dig into – and the 2513N 5×7 character ROM is one such chip. Amidst a long ...
Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...
It directly affects electrical performance, manufacturing yield, PCB layout complexity and long-term reliability. There are ...
As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...
Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...
More than 70% of global solar manufacturing facilities exhibited “major” or “critical” defects in 2025, according to a new report from Intertek CEA. New solar manufacturing facilities show higher ...
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