Thermal-induced stress is now one of the leading causes of transistor failures, and it is becoming a top focus for chipmakers as more and different kinds of chips and materials are packaged together ...

In the experiment, perovskite solar cells were repeatedly cooled to minus 150 degrees Celsius and then heated to plus 150 degrees Celsius. The changes in the microstructure of the perovskite layer and ...

A group of researchers led by Helmholtz-Zentrum Berlin (HZB) in Germany and China’s Henan University investigated repeated thermal stress cycles, reflecting diurnal cycles, on the degradation of metal ...

Thermal management deals with problems arising from heat dissipation, thermal stresses and warping. It is critical in the packaging of power semiconductors and other microelectronic and optoelectronic ...

A fixed-free rod is heated uniformly by an amount of ΔT. The rod experiences axial and transverse strains due to temperature increase; however, no stress is developed since the right end of the rod is ...