This article presents a method for predicting thermal behavior in integrated circuits. After characterizing thermal behavior, we formulate a mathematical model that simulates transient temperatures ...

For transient-thermal-analysis problems, running a full CFD (computational-fluid-dynamics) analysis to solve for mass, momentum, and energy equations using finite volume requires a lengthy computation ...

EXPERIMENTS recently carried out in this laboratory have shown that it is practicable to heat the wires of a thermocouple by the passage of an electric current and at the same time to record the ...

Thermal issues are becoming more difficult to resolve as chip features get smaller and systems get faster and more complex. They now require the integration of technologies from both the design and ...

Regardless of the system architecture, the circuit design, or the power levels involved, transient load current step testing is a critical aspect of power-system design, test, and verification.