Extensive Array of Back-End and Advanced Packaging Wet Wafer Process Equipment Leverages ACM’s Experience to Address Emerging Requirements for Wafer-Level Packaging FREMONT, Calif., Oct. 15, 2020 ...

Scientists in China have investigated the fracture strength of commercial G12 monocrystalline wafers via the 4-point bending test and have found that wafer thickness, the position of the silicon wafer ...

Cerebras Systems and the federal Department of Energy’s National Energy Technology Laboratory today announced that the company’s CS-1 system is more than 10,000 times faster than a graphics processing ...

Chip startup Graphcore Ltd. today introduced a new artificial intelligence processor, the Bow IPU, that uses an innovation dubbed wafer-on-wafer technology to speed up calculations. U.K.-based ...

Power consumption is a crucial consideration for all types of electronics. As critical power components used in a wide range of electronic products, power MOSFET and other types of power semiconductor ...

In an update to its International Technology Roadmap for Photovoltaics, German engineering association the VDMA notes standardization of wafer size is a topic of great interest to the country’s PV ...

Modern semiconductor fabrication involves aligning silicon wafers and photolithography masks to nanometre precision. As the industry shifts from using 200 mm diameter wafers to 300 mm wafers, ...

NOTTINGHAM, England--(BUSINESS WIRE)--A UK collaboration between Nottingham-based start-up, Search For The Next (SFN) and Glenrothes-based Semefab may be set to disrupt the semiconductor industry by ...

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Semiconductor manufacturer Xanoptix (Merrimack, NH) has developed a wafer-scale process for the 3-D stacking of silicon with either GaAs or InP to make compound semiconductors. The company's Hybrid ...