Recycling plastic at home using 3D printed molds is relatively accessible these days, but if you do not wish to invest a lot ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

Piper Plastics (Chandler, AZ) reports that it has developed a proprietary high-pressure molding technology that yields near-net-shape polymers up to 2 inches thick without porosity, voids or sinks.