Design-Reuse2h
AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing
The funding was led by Eclipse, with participation from Maverick Capital, Fundomo, EPIQ Capital Group, LLC, and legendary CPU ...
Design-Reuse2h
ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
ZeroPoint Technologies AB today announced a breakthrough hardware-accelerated memory optimization product that enables the ...
Design-Reuse2h
Siemens delivers certified and automated design flows for TSMC 3DFabric technologies
Siemens Digital Industries Software announced today, as part of its ongoing collaboration with TSMC, the readiness of an automated and certified workflow for TSMC’s InFO packaging technology using ...
Design-Reuse4d
YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
YorChip, Inc. in collaboration with its design partner SiliconIPs announces development of a 50nS latency 100G Ultra Ethernet ...
Design-Reuse7d
AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
AccelerComm's innovative use of vector processing cores for signal processing moves 5G satellite beyond proof-of-concept ...
Design-Reuse5d
RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
The rise of optimized reasoning models, capable of matching the performance of massive solutions like ChatGPT, strengthens ...
Design-Reuse6d
Dimensioning in 3D space: Object Volumetric Measurement by Leveraging Depth Camera-based Reconstruction on NVIDIA Edge devices
In this blog post, we shall explore the methodology of 3D reconstruction on the multi-view object scenes, used for volumetric ...
Design-Reuse3d
What should you consider when building an SoC?
A system on chip (SoC) is exactly as its name suggests, an entire system on a single silicon chip. This chip or integrated ...
Design-Reuse6d
TSMC Will Not Take Over Intel Operations, Observers Say
TSMC will not take over the chipmaking operations of struggling U.S. rival Intel, according to industry analysts.
Design-Reuse11d
Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
Siemens Digital Industries Software today announced that it has signed an exclusive OEM agreement for its EDA business to ...
Design-Reuse3d
Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
Logic Fruit Technologies is excited to announce its participation in Embedded World Europe 2025, taking place from March 11th ...
Design-Reuse4d
Ultra Low Latency 100G MAC/PCS for edge AI supports Ultra Ethernet
SiliconIPs announces development of a 50nS latency 100G Ultra Ethernet ready Mac/PCS IP core. The IP is optimized for size, ...