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The annual DesignCon show in Santa Clara, CA, is a treasure trove for innovative ideas on technologies that can solve current and future challenges in power and signal integrity. As hot trends such as ...

The Keysight Chiplet 3D Interconnect Designer automates the design of 3D interconnects for chiplet and 3DIC advanced packages. By removing time-consuming manual steps, the tool streamlines the ...

Collaboration validates Point2 Technology’s innovative e-Tube™ multi-terabit interconnects using Keysight's high-speed digital test solutions, addressing critical power and bandwidth challenges in AI ...

As optical transceivers continue to advance in bandwidth, power efficiency, and integration level, their influence is extending beyond the data-centre network and into the way AI systems themselves ...

For decades, electronics offered two levels of routing structure to manage signals that originate or terminate in an integrated circuit. Recently, that number has risen to five, and while it adds far ...

Chipmaker Marvell Technology Inc. said today it has agreed to acquire a networking startup called Celestial AI Inc. that’s developing optical interconnect technology to enable more rapid data center ...

Outages at major web hosts can have huge impacts across society, as we see often such as with the recent Cloudflare outage. But a new collaboration between Amazon and Google might just be the start of ...

Molex, a global electronics connectivity innovator, has agreed to acquire Smiths Interconnect, a Smiths Group subsidiary offering high-reliability connectivity products. Molex said Thursday the move ...

Interconnect technology in high bandwidth memory (HBM) is at a fork in the road. One direction leads to tried-and-true microbump technology, and the other leads to a compelling alternative, hybrid ...

AMD's chiplet architecture has not really changed in a fundamental way since the introduction of the Ryzen 3000 processors based on the Zen 2 architecture back in 2019. The move to Socket AM5 ...